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3 inch Ceramic lippage removal diamond disc/pad
  • 3 inch Ceramic lippage removal diamond disc/pad
  • 3 inch Ceramic lippage removal diamond disc/pad
  • 3 inch Ceramic lippage removal diamond disc/pad
  • 3 inch Ceramic lippage removal diamond disc/pad

3 inch Ceramic lippage removal diamond disc/pad

Item No.: CeramicLippage-003
These Ceramic bond lippage removal diamond pads are designed to work on 17 inch floor polisher, medium and large planetary and rotary machines.
Product parameters
Speed: 300-1000 RPM
Size: 3 inch
Grit: #30.50.100.200.400.
Thickness: 6mm
Usage(dry or wet): Wet
INQUIRY

”STCD” super true ceramic transitional diamond polishing pad are our latest diamond tool development and results in a superior floor with reduced steps.
The ceramic polishing pad is designed to cut and remove lippages easily and fast without scratches. The grinding process to a resin polishing process. These Ceramic bond diamond polishing pads are designed to work on 17 inch floor polisher, medium and large planetary and rotary machines.
Ceramic bond diamond polishing pads for lippage removal are an essential part of the grinding process, as lippage removal is among the first steps in preparing a floor for polishing. They perform excellently on concrete, natural, and engineered stones. Ceramic lippage removal pads are designed for wet applications only.
Ceramic bond diamond polishing pads for lippage removal are very aggressive because the diamonds open quicker than sintered bond tools.

Item No. Description
STCD-SW003-50 3”/80mm ceramic wet polishing pad, #50
STCD-SW003-100 3”/80mm ceramic wet polishing pad, #100
STCD-SW003-200 3”/80mm ceramic wet polishing pad, #200
STCD-SW003-400 3”/80mm ceramic wet polishing pad, #400
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